Bonding, printing, and die-cutting of functional materials: 'Pouch processing technology'
Total processing of functional materials such as electromagnetic wave shielding and thermal conductive materials for electronic information devices.
At Sunny Sealing Co., Ltd., we are advancing the development of products that integrate adhesive technology and printing technology to die-cut functional materials for sheet supply and finish them into rolls, in addition to traditional double-sided tape and film processing (die-cutting and laminated composite processing). There is no need to separate suppliers for printing processing and film processing, allowing for a consistent production process of "adhesion + printing + processing," which contributes to stable product supply and yield improvement for our users. 【Adhesive Technology Features】 ○ Work Size: 150mm x 100mm (MAX) ○ Adhesion Accuracy: ±0.5mm ○ Adhesion Environment: Clean Room Class 1000 For more details, please contact us or download the catalog.
- 企業：サニー・シーリング
- 価格：Other
